Element Six to Launch Cu-Diamond Composite for Advanced Thermal Management
Element Six (E6), a leader in synthetic diamond material solutions, will introduce its new Cu-Diamond product at Photonics West 2025. This copper-plated diamond composite is designed to address thermal management challenges in advanced semiconductor devices, offering high thermal and electrical conductivity for applications such as Artificial Intelligence (AI), high-performance computing (HPC), and GaN RF devices.
As semiconductor devices become more powerful, heat dissipation has emerged as a critical challenge. Over 50% of electronic device failures are heat-related, and with data centers projected to consume 10% of total U.S. power demand by 2029, efficient thermal management solutions are essential.
“Thermal management for semiconductor devices remains a significant challenge as power levels increase and packaging continues to advance,” said Daniel Twitchen, Chief Technologist at E6. “Our copper diamond composite offers a scalable and affordable solution for next-generation AI and HPC devices, enhancing performance and reliability while reducing cooling costs.”
The Cu-Diamond composite delivers exceptional thermal conductivity, reaching 800 W/mK, and is optimized for demanding applications. It supports high performance at lower costs, enabling widespread adoption. The material can be manufactured in complex shapes, facilitating integration into diverse 2.5/3D advanced packaging configurations.
Key advantages of the Cu-Diamond composite include reducing thermal management bottlenecks, improving device package thermal performance, increasing reliability, and enhancing output power. It maintains structural integrity after thermal cycle testing, and its thermal conductivity and coefficient of thermal expansion can be adjusted by varying the copper-diamond composition.
The composite is available in sizes ranging from a few millimeters to several centimeters and can be coated with thin metal layers such as gold and nickel for compatibility with standard die attach bonding. Custom shapes and features, including holes, steps, and curves, can be produced based on customer specifications.
Element Six will showcase the Cu-Diamond composite at Booth 5110 during Photonics West 2025, offering live demonstrations and expert insights.
