A new copper alloy developed by a team of researchers in the United States is showing promise for use in aerospace, defense, and industrial applications. The alloy, made from copper, tantalum, and lithium, demonstrates a combination of high strength, durability, and electrical conductivity not previously seen in copper-based materials.
The material was engineered at the nanoscale, with copper-lithium precipitates sandwiched between tantalum-rich layers. This structure was further refined by adding a small amount of lithium, which altered the precipitates into stable cuboid shapes. The result is an alloy that remains stable at temperatures up to 800°C (1,472°F) and can withstand a maximum stress of 1,120 megapascals at room temperature, exceeding the pressure tolerance of standard steel.
This copper-tantalum-lithium alloy also maintains its mechanical properties after prolonged exposure to high temperatures, resisting deformation and grain growth even after 10,000 hours at 800°C. The alloy’s unique structure provides both the high conductivity of copper and the strength and thermal stability found in nickel-based superalloys, which are commonly used in jet engines and other high-stress environments.
Potential uses for the new alloy include components for airplanes, spacecraft, heat exchangers, and high-performance electrical systems. The development opens up new possibilities for materials that need to perform reliably in extreme conditions, especially where both strength and conductivity are required.
